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Archives
2006
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You are about to review presentations, news releases, reports and/or filings of Pall Corporation that contain time-sensitive information. The information contained therein is only accurate as of the date thereof. Pall Corporation will not be reviewing or updating the material that is contained in these items after the date thereof. The information contained therein may be updated, amended, supplemented or otherwise altered by subsequent presentations, news releases, reports and/or filings by Pall Corporation. |
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Pall Helps Chip Manufacturers Improve Productivity with New Filter Family for Copper Electroplating Chemistries East Hills, NY (July 7, 2004) - - Pall Corporation (NYSE: PLL) is introducing its Varafine™ Varaclean Copper Electroplate Technology (CET) Series Filter Cartridges, a new family of filters specifically designed to reduce defects and improve productivity in high-volume copper plating processes. The new filters represent an important advance in the semiconductor industry’s move to mainstream manufacturing of copper devices across more product types.“For many device designs, manufacturers are replacing aluminum interconnects with copper, and putting these new designs into volume production,” said Steve Chisolm, president of Pall Microelectronics. “With the Varaclean CET filters, chipmakers can have the defect-reducing power of advanced, finer filtration without sacrificing productivity.” The Varaclean CET filter cartridges are based on Pall’s asymmetric membrane material, a patented technology that boosts filtration performance in volume manufacturing. The membrane filter is compatible with copper plating chemistries, including advanced additive packages used to enhance the copper plating process. The proprietary membrane technology filters impurities down to 50 nanometers(nm) while maintaining exceptionally high flow rates, a key requirement for meeting defectivity targets in manufacturing at the 65nm technology node. Currently in use on 200mm and 300mm copper electrochemical deposition (ECD) tools from major equipment manufacturers, the Varaclean CET filter cartridges are available in multiple sizes and grades, all of which offer greater than 99.9 percent removal efficiency. The need for advanced filtration in copper electroplating processes is expected to grow as copper devices move into mainstream manufacturing. According to recent forecasts from market researcher Gartner Dataquest, the market for copper ECD tools alone is expected to see steady, double-digit growth over the next several years, nearly doubling in size to $300 million by 2008. The new Varaclean CET filters are part of the Pall Microelectronics strategy to help customers address contamination control challenges in next-generation applications with novel chemical filtration technologies. Pall Microelectronics is the global leader in filtration, separations and purification technologies for the microelectronics industry. It supports the semiconductor, data storage, fiber optic, advance display and materials markets with a comprehensive suite of contamination control solutions for chemical, gas, water, chemical mechanical polishing (CMP) and photolithography processes. About Pall Corporation ### Editor’s Note: Pall executives will be available at Semicon West tradeshow, July 12-14, at San Francisco’s Moscone Center, Booth # 5556, North Hall to discuss copper plating filtration and other advanced contamination control technologies.
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